Ease of Doing Business Louds PM Modi’s Competitive Federalism in Semiconductor Case
Source: EODB NEWS | Published: 20 August
The competitive federalism that Prime Minister Narendra Modi often speaks about is visible in action here. States that have successfully secured semiconductor plants, and those that have not, are openly discussing the factors behind these allocations. This healthy competition ensures that, going forward, every state will focus on improving the ease of doing business parameters that influence such decisions, whether it is setting up a semiconductor plant or attracting other major manufacturing investments.
Abhijeet Sinha, National Program Director
Ease of Doing Business
In states that have not yet secured a single plant, citizens are increasingly voicing their concerns online. This is creating a sense of performance pressure on state governments, raising questions about why they are failing to attract such vital investment and manufacturing opportunities.
However, this is a form of positive pressure—as it pushes state administrations to review their policies, improve governance mechanisms, and address bottlenecks. By reducing the difficulty of doing business and actively promoting the ease of doing business, these states can position themselves more competitively to attract future investments and industrial growth.
Govt. approves four semiconductor plants in Odisha, Punjab, Andhra Pradesh
Source: THE HINDU | Published: August 12
The Union Cabinet on Tuesday (August 12, 2025) approved four projects under the India Semiconductor Mission (ISM). Two of the projects will be in Bhubaneswar in Odisha, and one each will be in Punjab and Andhra Pradesh. The cumulative value of the projects is ₹4,594 crore.
This brings the number of projects under the ₹76,000-crore mission, which provides financial support to semiconductor units, to ten.
Minister for Railways, Information and Broadcasting, Electronics and Information Technology Ashwini Vaishnav briefing the media on cabinet in New Delhi on August 12, 2025 | Photo Credit: Shiv Kumar Pushpakar
The first chip from one of the previous six units — some are competing, so it’s not clear which — will be rolled out in three months.
The firms behind the projects are SiCSem (which will make a silicon carbide integrated facility in Info Valley, Bhubaneswar); Continental Device India Private Limited, which will expand its existing “discrete semiconductor manufacturing facility” in Mohali; 3D Glass Solutions Inc., which will set up a “vertically integrated advanced packaging and embedded glass substrate unit” in Bhubaneswar; and Advanced System in Package (ASIP) Technologies, which will set up a semiconductor unit in Andhra Pradesh, with the location yet to be chosen.
Union Minister of Electronics and Information Technology Ashwini Vaishnaw said that having the capacity to work on silicon carbide technology, an “evolving” field, was strategically important for India. “IIT Bhubaneswar already has a ₹45 crore investment in a silicon carbide research unit, and the results have been very good,” he added.
